Advanced Package Failure Analysis Workshop

In the post-Moore era, advanced packaging is becoming more critical to meet the booming demands of electronic products with smaller size, more powerful performance and lower cost. As the semiconductor industry continues to evolve, the complexity of devices is on the rise, leading to new challenges in failure analysis. New package architectures introduce more complex defects that are buried deep below many layers, challenging the entire failure analysis workflow – from electrical characterisation to physical analysis and root cause determination. Traditional workflows for high-resolution package analysis of buried features lack the required combination of speed, resolution, and 3D information to understand the problems.

Learn how these advancements help you to identify, access, prepare and analyse regions of interest in advanced package architectures!